Spherical silicon micropowder

Spherical silicon micropowder:

Spherical silicon powder is a kind of spherical silica powder, the spherical rate of spherical silicon powder is about 95%, the chemical resistance, weather resistance, insulation, strengthening, thermal stability is excellent.

Our spherical silicon micropowder is manufactured from premium fused quartz or crystalline quartz raw materials through specialized processing. This high-strength, high-hardness, inert spherical granule features a SiO2 content exceeding 99.9%, with a whiteness of 95-98%, density of 2.2, Mohs hardness of 6.0, and fineness ranging from 30μm to 0.2μm. It exhibits a precisely controlled particle size distribution and appears as a white powder.

High-quality spherical silicon micropowder exhibits exceptionally low oil absorption, mixing viscosity, and friction coefficient. Its unique spherical structure grants superior powder flowability compared to angular quartz powders (silicon micropowders). The resulting powder pile forms a small angle of repose, ensuring dense compaction when blended with organic polymer materials to enhance structural integrity. Furthermore, it disperses easily, achieves uniform mixing, and significantly improves material flowability.

2、Our product specifications:

3. Characteristics and applications of spherical silicon micropowder:

The spherical silicon powder can greatly improve the rigidity, wear resistance, weather resistance, impact resistance, compressive strength, tensile strength, flame resistance, good arc insulation characteristics and UV radiation resistance of the products.

Given these characteristics, spherical silicon micropowder is widely used in the encapsulation of large-scale and ultra-large-scale integrated circuits, as well as in the insulation casting of electronic components and high-voltage electrical devices. It is also applied in various fields such as advanced rubber green tires, silicone rubber, silicon-based substrate materials, high-end inks, coatings, sealants, adhesives, electronic ceramics, optical quartz glass, engineering plastic reinforcement and modification, functional plastic films, drawn optical fibers, medical and dental materials, cosmetics, as well as chemical, pharmaceutical, and environmental protection industries. Spherical silicon micropowder has become one of the most important and critical basic raw materials in many high-tech fields.

4. The conventional physical properties and indexes of the sphere:

5. Main applications of spherical silicon micropowder:

   Spherical powders exhibit superior fluidity, ensuring uniform film formation when mixed with resin. They require minimal resin addition while maintaining optimal flow characteristics, allowing for maximum powder filling capacity with a weight ratio reaching 90.5%. This spherical morphology directly correlates with increased silicon micro-powder filling rates. Higher filling rates result in lower thermal expansion coefficients and reduced thermal conductivity, closely approximating the thermal expansion characteristics of monocrystalline silicon. Consequently, electronic components manufactured using this method demonstrate enhanced performance. Furthermore, spherical encapsulation materials minimize stress concentration while maintaining maximum strength. When the stress concentration of angular powder encapsulation materials reaches 1, spherical powders exhibit only 0.6 stress concentration. This ensures higher yield rates in integrated circuit chip encapsulation, with reduced mechanical damage during transportation, installation, and use. Additionally, spherical powders demonstrate lower friction coefficients, minimizing mold wear and extending mold lifespan. Compared to angular powders, spherical materials can double mold service life. Given the high cost of encapsulation molds (some requiring imports), this innovation significantly contributes to cost reduction and economic efficiency for packaging manufacturers.

   Spherical silicon micropowder is primarily used in the packaging of large-scale and very large-scale integrated circuits (VLSI). The decision to use spherical powder depends on the pitch density (the number of standard components per integrated circuit). When the pitch density ranges from 1M to 4M, spherical powder is partially utilized. For 8M to 16M pitch densities, spherical powder is fully adopted. At 250M pitch density, the line width of integrated circuits reaches 0.25μm. With 1G pitch density, the line width shrinks to 0.18μm – a level achieved by current PIV processor CPU chips. The spherical powder used at this stage is of higher grade, primarily made from polysilicon scraps through the hydrolysis of ethyl orthosilicate and silicon tetrachloride to produce SiO2, which is then shaped into spherical particles with adjustable particle sizes of (10-20)μm. This chemically synthesized spherical silicon micropowder costs ten times more than natural quartz-based alternatives. The reason lies in its near-zero radioactive alpha radiation contamination and ability to achieve uranium content below 0.02ppb. For high-pitch VLSI, the extremely narrow interconnects between circuits mean that packaging materials with high radioactivity could generate source errors during operation, compromising reliability. Therefore, strict radioactivity controls are essential. Natural quartz materials meeting (0.2-0.4)ppb standards are considered premium-grade. Currently, spherical powders used domestically are predominantly made from natural raw materials, including imported products.

VI. A Brief Analysis of Spherical Silicon Micropowder Technology:

Spherical silicon micropowder technology utilizes high-quality natural quartz minerals as its primary raw material, currently produced through two main processes: 1. The sol-gel method, which produces high-purity spherical amorphous silicon micropowders meeting electronic packaging material requirements under the presence of dispersants and spherical catalysts; 2. The flame or ion flame method, which melts the material into spherical amorphous silicon micropowders. In the high-end market, such as integrated circuit packaging, the second process is predominantly adopted. This breakthrough has broken the technological monopoly held by a few countries like the U.S., Japan, and Germany, marking significant progress in China's research on spherical silicon micropowders. Other preparation methods include alternating current high-frequency plasma melting, gas combustion flame method, and high-temperature melting injection.

7. Main Applications of Spherical Silicon Micropowder:

   Spherical silicon micropowder is mainly used in large-scale integrated circuit packaging, and also has applications in aerospace, fine chemical industry, erasable optical disc, large-area electronic substrate, special ceramics and daily cosmetics. It can save a lot of epoxy resin when used as filler in epoxy resin system.

   With the rapid development of China's microelectronics industry, the requirements for packaging materials in large-scale and ultra-large-scale integrated circuits have become increasingly stringent. These materials must not only be ultra-fine but also of high purity, with particular emphasis on achieving spherical particle morphology. However, the production of spherical silicon micropowder remains a highly challenging interdisciplinary endeavor, currently mastered by only a handful of countries including the United States, Japan, Germany, Canada, and Russia. It is widely recognized that China's current procurement of spherical silicon dioxide primarily relies on imports from Japan and South Korea, which come with high costs and extended delivery times. In contrast, domestically produced high-quality spherical silicon dioxide offers distinct localization advantages and can fully replace imported alternatives.