Spherical Silicon Micropowder for Electronic Packaging

Spherical Silicon Micropowder for Electronic Packaging

  The spherical silicon powder is the main raw material of the large-scale integrated circuit substrate and the electronic package material. It has the functions of reducing the thermal expansion coefficient of the plastic package material, increasing the thermal conductivity, reducing the dielectric constant, environmental protection, flame retardancy, reducing the internal stress, preventing the moisture absorption, increasing the strength of the plastic package material, reducing the cost of the package material, etc.

When combined with epoxy resin, it achieves bonding and encapsulation of chips or components. The thermal expansion coefficient of the substrate is determined by the proportion of ultra-fine silicon powder incorporated into the epoxy resin. A higher silicon powder content results in a lower thermal expansion coefficient, preventing damage to micron-scale circuits on silicon wafers caused by uneven expansion. Therefore, strict requirements are imposed on the purity, fineness, and particle size distribution of spherical powder. In electronic packaging materials, epoxy plastic encapsulant accounts for 80%, while silicone-based encapsulation materials make up the remaining 20%.

2、Our company's product specifications table:

III. Uniqueness of Spherical Silicon Micropowder:

1. Spherical surfaces exhibit excellent surface fluidity

The resin is uniformly mixed to form a film with minimal resin addition, allowing for maximum powder filling at a mass ratio of up to 90%. Spheroidization thus increases the filling rate of silicon micropowder. Higher filling rates result in lower thermal expansion coefficients and reduced thermal conductivity, making the material more similar to monocrystalline silicon. Consequently, the electronic components produced exhibit superior performance.

2. Spherical formation results in minimal stress concentration and maximum strength in the encapsulant.

When the stress concentration of the plastic encapsulation material of the angular powder is 1, the stress of the spherical powder is only 0.6. Therefore, the yield rate of the spherical powder is high, and the mechanical damage is not easy to occur in the process of transportation, installation and use.

3. Spherical powder exhibits a low friction coefficient, resulting in minimal wear on molds.

Compared with the angular powder, the service life of the mold can be doubled. The price of the encapsulation mold is very high, some of them need to be imported, which is very important to reduce the cost and improve the economic benefit of the encapsulation factory.

4. Properties and parameters of spherical silicon micropowder for electronic packaging:

Ultra-fine spherical silicon micropowder for electronic packaging is a key functional material. Produced from high-purity silicon ore through precision processes involving near-zero O₂ contamination wave vibration and air-flow bed technology, it exhibits exceptional chemical stability, low oil absorption, high purity, weather resistance, acid/alkali tolerance, high-temperature endurance, strong thickening properties, excellent electrical insulation, and UV resistance. The unique spherical structure generates four major effects, endowing the synthesized material with physical and chemical characteristics unmatched by conventional materials. These properties not only enhance traditional materials but also enable the creation of novel materials.

V. Product Advantages

1. This product features ultra-purity, ultra-whiteness, ultra-fine particle size, high-temperature resistance, and controllable particle size distribution;

2. Excellent physical and chemical properties: high insulation, high thermal stability, low thermal expansion coefficient, and strong weather resistance;

3. Fully replace imported silicon micro-powder products of the same type;

4. It can be used in high-end packaging products and meet the special performance requirements of high-end products.

5. Compliance with the EU RoHS Directive and SONY-GP standards, enabling broader application potential.

VI. Application Scope of Ultrafine Spherical Silicon Micropowder for Electronic Packaging:

1. Designed for UV-resistant LED silicone resin composite encapsulation, this solution enhances light output efficiency while reducing thermal resistance. It delivers high energy efficiency with superior reliability and extended lifespan, offering LED products a reliable performance range of 2,600K to 4,000K color temperature and more robust high-power encapsulation, effectively meeting diverse lighting requirements.

2. Used in LED, SMD, and EMC electronic separation devices, as well as electronic packaging materials for electrical products, the primary functions are waterproofing, dustproofing, protection against harmful gases, vibration damping, damage prevention, and circuit stabilization. High-purity silicon micropowder serves as the main raw material for large-scale integrated circuit substrates and electronic packaging materials. When combined with epoxy resin, it achieves chip or component bonding and sealing. The proportion of high-purity silicon micropowder in epoxy resin determines the substrate's thermal expansion coefficient. Higher powder content results in lower thermal expansion coefficients, preventing damage to micron-level circuits on silicon wafers caused by uneven expansion. Therefore, strict requirements are imposed on the purity, fineness, and particle size distribution of silicon micropowder. In electronic packaging materials, epoxy plastic encapsulant accounts for 80%, while silicone-based encapsulation materials make up 20%. When ultra-fine, high-purity, and uniformly sized silica (70-90% by weight) is added to epoxy plastic encapsulation materials, they exhibit excellent processability, minimal shrinkage, low thermal expansion coefficients, acid/alkali and solvent resistance, superior insulation properties, good mechanical performance, and enhanced transparency when mixed with epoxy resin.

3. Electronic substrate materials (electronic ceramics) can reduce sintering temperature and enhance toughness, density, and strength through the addition of ultra-fine ultra-pure silicon micro-powder. These materials serve as fundamental raw materials for electronic packaging products.

7. Performance characteristics of ultrafine spherical silicon micropowder for electronic packaging:

Spherical silicon micropowder, specifically designed for electronic packaging, significantly enhances product rigidity, wear resistance, weather resistance, impact resistance, compressive strength, tensile strength, flame resistance, excellent arc insulation properties, and UV radiation resistance. The epoxy resin encapsulant filled with spherical silicon micropowder exhibits low thermal conductivity and minimal expansion coefficient, achieving a 90% filling rate when used as substrates and packaging materials for microelectronic components. This makes it an ideal substrate and packaging material for large-scale and ultra-large-scale integrated circuits. Firstly, spherical quartz powder blends uniformly with resin to form a film, requiring minimal resin addition while maintaining optimal fluidity. The maximum weight ratio of spherical silicon micropowder can reach 90.5%, enabling the production of electronic components with exceptional performance. Secondly, the sphericalized encapsulant minimizes stress concentration and maximizes strength, resulting in high yield rates when packaging integrated circuit chips. It also reduces mechanical damage during transportation, installation, and use. Thirdly, the low friction coefficient of spherical powder minimizes mold wear, doubling the mold's service life and significantly reducing costs.