porous silica

porous silica

The porous silica is a new type of spherical silica powder material with a loose and porous structure, which can be obtained by an innovative and advanced process method, and it has a stable and narrow particle size distribution, a large specific surface area and a high purity.

It has been widely used in the fields of silicone, epoxy resin, composite materials, film opening agent, light diffusion agent, catalyst, slow-release microcapsule drug carrier and biomedicine because of its light weight, concentrated particle size distribution, good fluidity, spheroid-like and non-acute angle, good compatibility with resin, no interface after curing and uniform particle.

2. Key parameters of porous silica:

3. Product Features of Porous Silica:

1. The particle size distribution is highly concentrated, exhibiting an exceptionally unique thixotropic regulation property;

2. With a purity of up to 99.9% and minimal impurities;

3. Spherical-like particles with excellent dispersibility;

4. The structure is loose and porous, with a low bulk density;

5. Porous structure with strong adsorption capacity, achieving oil absorption of 90% of its own weight;

6. Narrow particle size distribution, good compatibility with resin, and no interface after curing.

4、Advantages of porous silica applications:

1. In copper-clad laminate (CCL), porous silica exhibits lower hardness and better fluidity compared to crushed quartz powder. This property reduces drill bit wear during PCB fabrication and enhances drilling accuracy. Additionally, it lowers the dielectric constant of PCBs, thereby improving signal transmission speed and minimizing dielectric loss.

2. The porous structure can form a cross-linked network with resin to improve the strength of the product.

3. The average particle size (D50) is adjustable within the range of 1-10 μm, with a concentrated particle size distribution and controllable large particles.

4. In epoxy resin and silicone gel, the shrinkage rate of cured products can be reduced by filling with porous silicon micropowder. Its unique porous structure forms an interpenetrating network (IPN) with the resin matrix, thereby enhancing the tensile strength, flexural strength, toughness, and ductility of the resin matrix.

5. In lightweight plastics, the polymer cannot penetrate the nanopores of porous silicon micropowder, which can be regarded as "hollow glass beads" in engineering plastics to produce low-density (low specific gravity) engineering plastics.

6. In paint coatings, its unique porous structure can form an interpenetrating network (IPN) with the resin matrix, thereby enhancing the film strength and scratch resistance.

7、In the application of light aluminum-magnesium alloy, the molten metal cannot penetrate the nanopores of the porous silicon powder. In this case, the porous silicon powder can be regarded as a "hollow glass microsphere." Unlike hollow glass microspheres, the porous silicon powder does not experience internal pressure buildup that could lead to rupture or explosion at high temperatures.

8. In the application field of high-end film opening agents, the specific gravity of porous silicon is only half that of spherical silicon micropowder, which can significantly reduce production costs. Additionally, its abundant internal nanopores facilitate light transmission, making it suitable for high-transparency and high-light-transmittance films.

9. The addition of a small amount of mesoporous silica to traditional coatings can effectively solve the problems of poor suspension stability, poor thixotropy, poor anti-aging properties, and low glossiness.

10. In catalytic and drug-loaded carriers, due to their porous structure, they can be used as sustained-release agents in medicine, serving as drug reservoirs to release drugs at appropriate sites.

5、Application fields of porous silica:

1. Low-thickening anti-settling agents/strengthening fillers/tixotropic modifiers for adhesives such as silicone and epoxy resins;

2. Lightweight fillers for composite materials such as rubber, plastics, and aluminum-magnesium alloys;

3. Film opening agents for BOPP, PET, PP, and light diffusers for PC and PMMA;

4. Anti-scratch and wear-resistant fillers, matting agents, and powder coatings additives for paint and coatings;

5. Drug carriers, sustained-release microcapsules.