low-density silicon micropowder

Low-density silicon micropowder

It is an important inorganic non-metallic mineral functional powder material. It is made of high purity natural quartz and other inorganic non-metallic minerals as raw materials, through the process of compounding, melting, cooling, crushing, magnetic separation, grinding, fine grading and other fine processing technology, the molecular structure of which is changed from ordered arrangement to disordered arrangement.

The material exhibits a pure white color with high purity and possesses the following characteristics: stable chemical properties, well-defined and controllable particle size distribution, excellent temperature resistance, acid and alkali corrosion resistance, high-temperature tolerance, superior electrical insulation, poor thermal conductivity, high insulation, a very low linear expansion coefficient, high purity, low hardness, large specific surface area, and good electromagnetic radiation properties.

II. Our company's product specifications:

3. Basic Performance Parameters:

Silicon micropowder can be classified by the following characteristics and customized to meet customer requirements:

IV. Product Features and Advantages:

1. Low hardness significantly reduces wear on contact surfaces;

2. Stable chemical properties and excellent electrical insulation performance;

3. Good thermal performance with low thermal expansion coefficient;

4. High whiteness and excellent transparency;

5、The interface compatibility with resin is good.

6、Low ionic content, low conductivity, excellent electrical insulation;

7、The oil absorption is low, the viscosity is low, the dispersion and fluidity are good;

8、It has the properties of chemical stability, acid and alkali resistance, high temperature resistance and good insulation;

9、high wear resistance, improve the scratch resistance of coating film;

10、The product has high purity, good whiteness, uniform particle size distribution and low hardness, which greatly reduces the wear of drill bit in the process of drilling copper clad laminate and prolongs the service life of drill bit.

5. Scope of Application:

Copper clad laminate, ink and coating, adhesive, electronic packaging, composite materials, etc.

6. Our silicon micropowder exhibits distinct physical properties when applied in the copper-clad laminate industry:

Three highs: high insulation, high thermal conductivity, and high thermal stability;

Three low: low thermal expansion coefficient, low dielectric constant, low raw material cost;

Dual resistance-Resistance to acids and alkalis, and wear resistance

VII. Application Analysis of Low Hardness, Low Density, and Low Specific Gravity Silicon Micropowder in the Copper Clad Laminate Industry:

Silica (SiO2) has excellent electrical properties, such as high insulation, high thermal conductivity, high thermal stability, acid and alkali resistance, wear resistance, low thermal expansion coefficient, low dielectric constant, and its low price advantage, all of which have certain development and utilization value.

With the improvement of the surface physical condition of silica, the compatibility of silica with the resin system is improved. Therefore, silica as a filler used in copper clad laminate can not only reduce the cost, but also improve some properties of copper clad laminate (such as thermal expansion coefficient, bending strength, dimensional stability, etc.), so the prospect is promising.

VIII. Selection of Silicon Dioxide

In the past, aluminum hydroxide and magnesium hydroxide were commonly used as fillers in copper-clad laminates (e.g., CEM3). However, aluminum hydroxide decomposes at temperatures above 200°C, making it less heat-resistant, while magnesium hydroxide is relatively expensive. Silicon dioxide, on the other hand, offers superior performance in copper-clad laminates at a cost comparable to aluminum hydroxide.

Comparison of the Properties of the Substrate with Silica,Alumina and Magnesium Hydroxide as Fillers